Infineon, DE0006231004

Infineon stock at EUR 50.86, up 4.61% premarket

Published on 11/10/2026 at 08:05 | Editorial responsibility: Rafael Müller, Editor-in-Chief AD HOC NEWS
Infineon will show its first processed 300-millimeter SiC wafer at electronica in Munich from November 10 to 13. The reference base is the Xetra close of November 9, 2026 at EUR 48.62.

Key points for Infineon investors

  • Infineon has processed functional power devices on 300-millimeter silicon-carbide wafers at its Villach fab.
  • The larger wafer diameter can deliver 2.3 times more chips per wafer than 200-millimeter wafers.
  • The company will present the technology at electronica in Munich from November 10 to 13, 2026.
Infineon, DE0006231004, Illustration mit AI erstellt.

Infineon stock traded at EUR 50.86 on Lang & Schwarz at 08:03 CET on Tuesday, November 10, 4.61 percent above the Xetra close of Monday, November 9 at EUR 48.62.

Infineon said in a Nov. 9 press release that it had processed 300-millimeter silicon-carbide wafers into functional power devices at its Villach, Austria, fab. The company described the achievement as an industry first in a full-scale semiconductor fab environment.

Technology and results in focus

Infineon says the larger wafer diameter offers 2.3 times more chips per wafer than 200-millimeter wafers. The company plans to develop the 300-millimeter SiC technology and ramp timing with customers and partners while continuing its 200-millimeter manufacturing roadmap.

The investor calendar lists Infineon's fiscal fourth-quarter and full-year 2026 results for 7:30 CET on Tuesday, November 10. The results date coincides with the start of electronica 2026 in Munich, where Infineon plans to display the processed wafer through November 13.

The DAX provides the relevant German market backdrop for the semiconductor stock.

More news and analyses on Infineon stock.

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