Infineon Rolls Out AI Data Center Reference Designs as Enphase Deal Lifts Shares

Infineon Technologies has moved on two fronts in the power electronics that underpin artificial intelligence infrastructure, unveiling a high-voltage power distribution board reference design and a server power supply reference design on the same day it basked in the glow of a fresh supply win.

The distribution board lets customers evaluate systems built around ±400 V and 800 V architectures, aimed squarely at AI data center applications. Alongside it, the company launched a 5.6-kW M-CRPS reference design for enterprise servers and edge AI, which Infineon says reaches a peak efficiency of 98+ percent and offers high power density. Rounding out the day's product news, Infineon introduced ENDOPACK, a new brand for its chip-embedding solutions.

Enphase Switch Deal Draws Market Attention

The product rollouts follow Monday's announcement of a cooperation with Enphase Energy. Under the arrangement, Infineon will supply monolithic 900-V GaN bidirectional switches destined for Enphase's solid-state transformer power modules, applications that include AI data centers. The components have already been tested and are now being integrated directly into ongoing product development.

Investors responded with clear demand. Infineon shares climbed 4.9 percent to EUR 50.91 on the day, lifting the stock's gain since the start of the year to 35 percent. Media reports pointed not only to the company's own product news but also to a supportive sector backdrop, with investors citing tailwinds from the US, where gains among American chip stocks lifted sentiment. A key driver was the strength of NXP and its newly signed agreement with Volkswagen for the supply of automotive chips.

A String of Technology and Supply Deals

The Enphase contract slots into a broader series of technological initiatives. On October 21, Infineon and Nvidia disclosed an expansion of their collaboration focused on GaN-based high-voltage intermediate bus converters for 800-V DC architectures in AI data centers. Two days earlier, on October 19, Infineon, Volkswagen CARIAD and the Volkswagen China Technology Company signed an agreement and opened a joint innovation center for automotive chips in Hefei.

On the materials side, Infineon and Wolfspeed concluded a multi-year supply agreement on October 15 for 200-mm silicon carbide wafers, upgrading an existing partnership from 150-mm to 200-mm wafers. Infineon said the arrangement should strengthen the resilience of its own supply chain.

The company's next scheduled reporting date is November 10, 2026, when it plans to publish full-year figures for fiscal 2025/26.