The EasyPACK 2B IGBT module - Infineon bets on compact power for EV inverters
Published on 07/17/2026 at 10:19 | Editorial responsibility: Rafael Müller, Editor-in-Chief AD HOC NEWS
EasyPACK 2B IGBT module is the kind of hardware you imagine bolted into a dusty test rig, humming quietly while cooling fins warm to the touch. The compact power module sits at the heart of many electric drive experiments that Infineon engineer Markus Huber likes to push to the limit.
What the EasyPACK 2B does
Infineon’s EasyPACK 2B IGBT module is a family of insulated gate bipolar transistor power modules designed for mid?power applications such as EV inverters and industrial drives. The 2B housing offers a footprint around 62 mm by 59 mm, with standardized pin assignments across variants.
Inside the molded housing, Infineon combines IGBT chips and free?wheel diodes to handle typical DC link voltages of 600 V to 1200 V, depending on the specific type. Current ratings commonly range from around 50 A up to roughly 150 A per switch position, tailored for three?phase bridge configurations.
Infineon Technologies AG in the power electronics market
Background data, news and regulatory filings help investors read the EasyPACK power module line in the broader Infineon strategy.
Design choices and tactile details
On Infineon’s product page, the EasyPACK 2B is presented as part of the Easy family of power modules, which rely on PressFIT contacts instead of soldered pins for board connection. That design lets manufacturing engineers literally feel the module lock into the PCB with a firm mechanical click when mounting.
The modules typically use copper baseplates or direct copper?bonded ceramic substrates to spread heat toward the cooling interface. When mounted to a liquid?cooled cold plate in an EV inverter, the outside of the EasyPACK 2B stays only mildly warm during nominal load, while the internal junction temperature swings with each acceleration pulse.
Why EV inverter designers look at EasyPACK 2B
Infineon highlights the EasyPACK 2B IGBT modules as suited for traction inverters in hybrid and battery electric vehicles where power levels range roughly from 20 kW to 75 kW per module. For a typical three?phase bridge configuration, that means one module can serve as the core switching block of a compact mid?power drive.
The automotive?qualified variants come with enhanced isolation capability and thermal cycling robustness, addressing the vibration and temperature swings in vehicle environments. Product manager Dr. Christian Blatt stresses in technical notes that automotive designers focus on predictable thermal impedance curves more than on headline current numbers.
Switching characteristics and efficiency
In Infineon’s datasheets for EasyPACK 2B IGBT modules, typical switching frequencies land in the 5 kHz to 20 kHz range for traction inverters, depending on the exact chip generation and gate resistors. At these frequencies, designers balance conduction losses against switching losses to reach system efficiencies above 95 percent.
The modules often integrate fast free?wheel diodes matched to the IGBT chips, which reduces reverse recovery energy and helps keep switching waveforms cleaner on the oscilloscope. When an engineer like Huber probes the phase currents, he feels the difference between a tuned gate network and a rough prototype in the audible inverter whine.
EasyPACK 2B in industrial drives
Beyond EVs, Infineon positions the EasyPACK 2B IGBT modules in industrial motor drives, including pumps, fans and compressors in the 15 kW to 45 kW class. These applications typically require long lifetime under constant partial load rather than aggressive peak current bursts.
Industrial designers often mount several EasyPACK 2B modules side by side on an aluminum heatsink to build multi?motor drive cabinets. The uniform module outline and PressFIT contacts make it simpler to route busbars and gate driver boards without custom mechanical work for each power level.
IGBT chip generations inside
Infineon’s public documentation refers to various IGBT chip generations such as TRENCHSTOP IGBT4 or IGBT7 being housed inside EasyPACK modules over time. Newer generations cut conduction losses and offer improved short?circuit withstand times, which matters for automotive safety requirements in fault conditions.
When customers specify an EasyPACK 2B variant, they select not only the current and voltage ratings but also the chip generation, which influences efficiency and control strategy. Specialist reviews of traction inverter designs often point out how newer Infineon chips let designers shave a few milliohms off effective conduction resistance.
Thermal interfaces and cooling
The thermal path in EasyPACK 2B IGBT modules runs from chip through the ceramic substrate to a metal baseplate and then into the cooling structure. Infineon recommends even mounting pressure and thermal interface materials such as silicone?based pads or greases to minimize contact resistance.
Hands?on inverter builders sometimes describe how a freshly mounted EasyPACK module leaves a thin smear of thermal paste on the fingertips, a reminder that mechanical cleanliness matters for electrical efficiency. Over time, uneven clamping or dried?out paste can raise thermal resistance and reduce current capability.
PressFIT concept and assembly
Infineon’s EasyPACK family, including the 2B housing, is associated with PressFIT technology for pin contacts. Instead of soldering, the pins press into plated through?holes, creating a gas?tight electrical and mechanical connection that can be released only with significant force.
For large production runs, this approach cuts out wave soldering steps and reduces thermal stress on the PCB. Assembly lines with automated presses record the insertion force curves of each module, giving quality engineers data on whether each EasyPACK 2B is properly seated before the inverter housing is closed.
Gate driver considerations
To drive an EasyPACK 2B IGBT module, designers use galvanically isolated gate driver boards with adjustable gate resistances and Miller clamp functions. Infineon and third?party suppliers publish reference designs that show recommended layouts to minimize stray inductance around the module pins.
These boards often sit almost flush against the top of the EasyPACK housing, with short traces to the pins and carefully routed supply lines. In lab setups, engineers tap the driver supply rails and gate signals with thin probes, listening for subtle coil buzz that betrays layout imperfections.
Target markets and regional focus
Infineon indicates that EasyPACK IGBT modules, including the 2B variants, are widely used by automotive Tier?1 suppliers and industrial equipment makers across Europe and Asia. Many early traction inverters based on these modules showed up first in Chinese and European mid?segment electric vehicles.
Availability is centered on OEM and B2B channels rather than consumer retail. Industrial distributors list EasyPACK 2B modules with minimum order quantities that start at tray level, making them more visible to inverter manufacturers than to end customers.
Pricing and procurement dynamics
Typical per?unit prices for EasyPACK 2B IGBT modules depend heavily on volume, voltage class and chip generation, with catalog prices often in the low three?digit euro range for small quantities. Framework agreements with automotive customers can push effective prices lower when volumes reach tens of thousands per year.
Procurement managers track Infineon’s lead times and allocation status carefully, particularly when EV demand spikes. In tight markets, some designers temporarily qualify alternative modules, but many prefer the EasyPACK form factor and wait out allocation periods rather than redesign mechanical and electrical interfaces.
Comparison to other Infineon modules
Within Infineon’s broader portfolio, EasyPACK 2B IGBT modules sit between smaller EasyPACK 1B devices and larger power modules such as EconoPACK. The 2B size balances compactness with enough chip area to handle mid?level traction and industrial drives.
Larger EconoPACK modules target higher power levels and often feature screw terminals and more complex internal layouts. Designers choose between these families based on target power, cooling concept and mechanical integration, weighing the cost of redesigning housings against potential efficiency gains.
Supply chain resilience and strategy
Infineon has repeatedly emphasized in public communications that it is expanding capacity for automotive and industrial power semiconductors. The EasyPACK line benefits from these investments, as higher wafer and module assembly capacity helps stabilize delivery against EV demand cycles.
CEO Jochen Hanebeck points out in interviews that automotive power electronics, including modules like EasyPACK 2B, form a core pillar of Infineon’s long?term growth strategy. That means the company allocates engineering resources not only to new chip generations but also to incremental module assembly and test improvements.
How investors might read EasyPACK 2B
For holders of Infineon Technologies AG stock, the EasyPACK 2B IGBT module is one tile in a much larger mosaic of power electronics. The module itself won’t move the share price on its own, but it underpins several EV and industrial drive platforms that generate recurring component revenue.
Key facts about EasyPACK 2B IGBT module
- Product: EasyPACK 2B IGBT module
- Manufacturer: Infineon Technologies AG
- Category: Lifestyle / Consumer power electronics (EV and industrial drives)
- Market launch: EasyPACK 2B housing introduced around mid?2000s, later automotive IGBT generations added in the 2010s
- MSRP / Price: Typically low three?digit euro range per unit in small quantities, strongly volume?dependent
- Availability: Primarily via OEM and industrial distribution channels; not targeted at consumer retail
- Target group: Automotive Tier?1 suppliers, EV inverter designers, industrial motor drive manufacturers
- Highlight / USP: Compact PressFIT power module for mid?power three?phase inverters, balancing size, ease of assembly and robust thermal performance
Disclaimer regarding our articles: No investment advice, no buy or sell recommendation. Information on prices, companies, and markets is provided without guarantee; changes are possible at any time. Stock market transactions can lead to substantial losses. Our articles are created and reviewed in whole or in part automatically with the support of AI.
