New launch milestone puts Park Aerospace’s PKE 2.9 oz style 1080 prepreg in the spotlight

Park Aerospace is highlighting its PKE 2.9 oz style 1080 fiberglass reinforced prepreg as a key low-flow material for multilayer rigid printed wiring boards, targeting high-reliability aerospace and defense applications with controlled resin content and tight process tolerances.

Edited by ad hoc news New Releases & Launches Desk. Reviewed before publication on 06/16/2026 at 2:26 PM ET. Details in the imprint.

Park Aerospace is sharpening the focus on its PKE 2.9 oz style 1080 fiberglass reinforced prepreg, a low-flow epoxy-based material designed for multilayer rigid printed wiring boards in demanding aerospace and defense electronics. The prepreg uses a carefully controlled resin content over style 1080 glass cloth to deliver consistent lamination performance for complex, high-layer-count boards in avionics, radar and satellite systems. Park positions the PKE 2.9 oz style 1080 prepreg as part of its broader composite materials lineup for high-reliability OEMs that need tight dielectric control and stable mechanical behavior across wide operating temperature ranges. According to Park, the PKE prepreg family is manufactured in Newton, Kansas under aerospace-grade quality systems, reflecting the company’s long-standing focus on high-performance electronic materials for flight hardware.

What Park’s PKE 2.9 oz style 1080 prepreg is built to do

The core of the product is a low-flow, epoxy-based resin system impregnated into 2.9 oz per square yard style 1080 E-glass fabric, optimized for use as bonding plies in multilayer rigid printed wiring boards where controlled flow and minimal resin squeeze-out are critical. Park describes its PKE prepregs as offering stable lamination behavior, enabling fabricators to maintain dielectric spacing and copper feature geometry even when stacking high layer counts under elevated pressure and temperature. The 2.9 oz style 1080 variant is aimed at board designs that rely on relatively thin dielectric layers but still require good mechanical robustness and resistance to thermal cycling typical of avionics environments. In this role, the low-flow characteristic helps prevent resin from flooding adjacent cavities or plated through-hole areas during lamination, mitigating risks such as voids, resin-rich pockets or through-hole barrel defects that could undermine long-term reliability.

Park Aerospace lists the PKE 2.9 oz style 1080 prepreg among its electronic materials for multilayer rigid printed wiring boards, specifying that the PKE line is available in multiple glass styles and resin contents to suit different board stack-up requirements and process windows. The 2.9 oz style 1080 material is typically supplied in roll or panel form with tightly controlled volatile content and gel time, allowing fabricators to integrate it into existing lamination processes without major equipment changes. PKE prepregs are targeted particularly at aerospace, defense and other high-reliability electronics manufacturers who need traceable materials that meet stringent quality documentation and lot-to-lot consistency requirements. Park emphasizes that its PKE prepregs, including the 2.9 oz style 1080 version, are compatible with common copper foils and can be used alongside other Park dielectric materials in hybrid stack-ups for tailored electrical performance. The company notes in its product literature that PKE prepregs are produced under AS9100D-certified quality management, underscoring their alignment with aviation and defense industry standards. This positioning is consistent with Park’s broader strategy in electronic materials, which is to concentrate on high-value applications rather than commodity PCB laminates, leveraging its expertise in advanced composites and aerospace supply chains.

Within Park Aerospace’s portfolio, the PKE 2.9 oz style 1080 prepreg complements the company’s other high-performance materials for printed wiring boards and structural composites that supply commercial and military aircraft, space hardware and specialty industrial systems. While the company does not break out revenue at the individual prepreg product level, electronics materials form one of Park’s two main business pillars alongside advanced composite structures. For investors, the PKE product line illustrates how Park seeks to anchor growth in specialized aerospace-qualified materials rather than volume-driven commodity laminates, with the Newton, Kansas facility serving as a central hub for these activities. Shares of Park Aerospace’s parent company Park Aerospace Corp. (ISIN US70126K1016) traded on the NYSE at $14.46 on 06/14/2026.

PKE 2.9 oz style 1080 prepreg in brief

• Product: PKE 2.9 oz style 1080 fiberglass reinforced prepreg
• Manufacturer: Park Aerospace Corp.
• Category: New Release/Launch - electronic materials prepreg
• Launch date: Not specifically disclosed; part of ongoing PKE prepreg line
• MSRP / Price: Not publicly listed; typically priced per unit area and order volume
• Availability: Supplied directly by Park Aerospace to PCB fabricators and aerospace/defense OEMs
• Target audience: High-reliability multilayer rigid printed wiring board manufacturers and aerospace, defense, and industrial electronics OEMs
• Key differentiator / USP: Low-flow epoxy resin on style 1080 E-glass with controlled resin content for precise dielectric spacing and reliable lamination in demanding avionics and defense boards

This article was a.i.-assisted and editorially reviewed. Product information without warranty; prices and availability may change at short notice. Not investment advice and not a buy or sell recommendation. Trading involves risk up to and including the total loss of invested capital.