Intel’s Packaging Technology Emerges as Strategic Advantage

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A specialized recruitment drive by Apple and Qualcomm has unexpectedly highlighted one of Intel’s most valuable assets. Both tech giants are actively pursuing engineers with expertise in EMIB, an advanced packaging technology developed by the chipmaker. This development positions Intel favorably at a time when many investors had grown skeptical about the company’s future prospects. Could packaging innovation ultimately drive Intel’s recovery?

In a surprising strategic pivot, Intel may transition from being a direct competitor to Taiwan Semiconductor Manufacturing Company (TSMC) to serving as a downstream partner. The potential collaboration would involve Intel packaging chips manufactured by TSMC using its proprietary EMIB technology.