Intel’s Foundry Ambitions: A Potential Lifeline from Apple and Nvidia

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A recent statement from Apple's CEO has ignited speculation about a significant shift in the semiconductor supply chain, potentially benefiting Intel's contract manufacturing division. During a February 1, 2026, conference call, Tim Cook confirmed that iPhone production is being constrained by shortages of advanced chip fabrication nodes. This admission has led industry observers to suggest that Intel could begin producing specific chip components for both Apple and Nvidia as early as 2027 or 2028.

The global chip industry may be on the verge of a realignment. Leading-edge capacity constraints at the dominant foundry, TSMC, are reportedly pushing major technology firms to scout for alternative suppliers. According to analyses from AInvest and DIGITIMES Asia, Apple is evaluating Intel’s 18A process node for manufacturing future M-series chips destined for MacBooks and iPads, with a potential start date in 2027.

In a parallel development, Nvidia is said to be considering a limited partnership with Intel. The graphics processing unit giant might leverage Intel’s fabrication capacity for the I/O dies of its planned "Feynman" generation, scheduled for 2028. These components would be produced using Intel’s 18A or 14A processes, while the computationally intensive core dies are expected to remain in production at TSMC.

Technical Skepticism for iPhone Integration

Despite the encouraging signals for Mac chips, industry experts express considerable doubt regarding Intel’s technology appearing in iPhones. A technical assessment published by the analysis portal igor'sLAB places the likelihood of Intel’s 18A or 14A nodes being used for iPhone system-on-chips at "precisely zero."

The primary obstacle is thermal management. Intel’s PowerVia technology, which implements backside power delivery, enhances energy efficiency but creates localized heat concentration, or hotspots. These thermal challenges are difficult to manage within the passive cooling constraints of a smartphone. While active cooling systems in devices like MacBooks could potentially handle the heat dissipation, the strict thermal budget of an iPhone currently renders such an integration unfeasible.

Market Caution Amid Heavy Investment

Intel is undertaking substantial investments to advance its technological roadmap, recently installing high-numerical aperture ASML lithography systems to boost its manufacturing capabilities. The market response, however, remains cautious. On February 2, 2026, DZ Bank downgraded Intel shares to "Sell," assigning a price target of $36 U.S. dollars. This pessimistic rating stands in stark contrast to the company's ambitious plans to capture a share of the rapidly expanding market for artificial intelligence semiconductors.

The coming months will be critical for Intel. The company must demonstrate it can overcome the technical hurdles associated with its PowerVia innovation to establish itself as a credible alternative to TSMC. Current discussions with Apple and Nvidia are understood to be in preliminary stages, and no firm manufacturing contracts have been confirmed to date.