Unisem stock targets AI demand with RM396 million plant expansion
Published on 11/04/2026 at 02:46 | Editorial responsibility: Rafael Müller, Editor-in-Chief AD HOC NEWSExpansion targets advanced chip demand
- Unisem plans to spend RM396 million on a second expansion phase at its Gopeng semiconductor plant in Perak.
- The project is designed to add wafer-bumping and post-bump capacity for artificial intelligence, data-centre and high-performance computing applications.
- The company expects no material earnings impact in the current financial year, with benefits expected after the facility becomes operational.
Unisem (M) Berhad plans to invest RM396 million in the second phase of its Gopeng semiconductor plant expansion, according to The Edge Malaysia in a report published Wednesday, November 4, 2026. The underlying filing was made on October 9.
Capacity aimed at AI supply chains
The planned project covers a new production facility with approximately 40,000 square metres of built-up area and an estimated construction cost of RM196 million. A further RM200 million is earmarked for equipment and facility preparation.
Half of the facility will be leased to wholly owned Unisem Advanced Technologies Sdn Bhd for wafer-bumping operations. The additional capacity will also support post-bump services used in advanced semiconductor packaging.
Unisem said demand from artificial intelligence, data centres and high-performance computing is driving the expansion. The project is expected to be funded through internally generated funds and bank borrowings, although the final mix has not been determined.
Growth arrives after investment phase
The company does not expect the project to materially affect earnings in the current financial year. It expects a positive contribution once the facility is completed and operational, leaving investors to weigh near-term spending against longer-term capacity growth.
The expansion follows an earlier Gopeng investment that began in March 2022. The Edge reported that the first phase was initially estimated at RM300 million and was intended to double the capacity of Unisem's existing Ipoh operations.
Malaysia's semiconductor position is also linked to the broader AI infrastructure cycle. The Star described Unisem alongside Inari Amertron Bhd and Malaysian Pacific Industries Bhd as one of Malaysia's listed outsourced semiconductor assembly and test companies.
Unisem's operating position
Unisem operates turnkey semiconductor assembly and test facilities in Ipoh and Chengdu, while Unisem Advanced Technologies supports the group's advanced packaging activities. Its operations are focused on packaging, testing, wafer bumping and related semiconductor services across Malaysia and China.
In Malaysia's listed OSAT sector, Unisem competes with Inari Amertron and Malaysian Pacific Industries. The three companies provide investors with exposure to the same broad packaging and testing supply chain, while Unisem is specifically expanding its wafer-bumping and post-bump capacity in Gopeng.
Unisem stock at a glance
- Company: Unisem (M) Berhad
- Ticker: 5005.KL
- Exchange: Bursa Malaysia
- Planned investment: RM396 million
- Expansion site: Gopeng, Perak, Malaysia
Malaysia's semiconductor packaging and testing sector remains exposed to demand from AI infrastructure, data centres and high-performance computing, alongside other electronics applications. Current market reports provide the wider European market context.
Further company developments and sector analysis are available in More news and analyses on Unisem stock.
