Hanmi Semiconductor stock: Chairman plans 10 billion won share buy
Published on 11/13/2026 at 01:45 | Editorial responsibility: Rafael Müller, Editor-in-Chief AD HOC NEWSShare purchase signals continued confidence
- Chairman Kwak Dong-shin plans another open-market purchase of Hanmi Semiconductor shares.
- The company expects record annual revenue in 2026 after record sales in the two previous years.
- HBM bonders, advanced packaging equipment and the new U.S. subsidiary remain central to the growth outlook.
Hanmi Semiconductor said on November 4, 2026, that Chairman Kwak Dong-shin plans to spend 10 billion won of his personal funds on company shares in an open-market purchase scheduled for December 2. The announcement was reported by The Asia Business Daily.
The planned transaction would lift Kwak's stake to 33.69 percent and bring his cumulative personal purchases since 2023 to 80.2 billion won. His purchases this year would total 26.7 billion won across five transactions. The latest plan therefore adds to an established buying pattern rather than representing a first investment by the chairman.
HBM demand remains the central driver
Hanmi expects 2026 revenue to reach a record for the third consecutive year, following record sales in 2024 and 2025. Management points to rising investment in high-bandwidth memory manufacturing and advanced artificial intelligence packaging as key demand drivers.
The company's product range includes thermocompression bonders for next-generation HBM, flip-chip bonders, Micro Saw and Vision Placement systems, and electromagnetic-interference shielding equipment. The Asia Business Daily also reported that Hanmi established Hanmi USA in San Jose, California, in October to support local customers and expand equipment supply as U.S. semiconductor manufacturing investment grows.
Patent mediation adds a legal risk
Hanmi is also pursuing mediation with Hanwha Semitech in a patent dispute over thermocompression bonders, according to Asia IP. The mediation follows a recommendation by South Korea's Intellectual Property Trial and Appeal Board and postponed a court hearing that had been scheduled for November 3.
Hanmi disputes Hanwha's infringement allegations. If mediation fails, court and patent invalidation proceedings could continue, leaving legal uncertainty around competition and equipment procurement in South Korea's HBM supply chain.
Business model and competitive position
Hanmi Semiconductor develops and manufactures semiconductor packaging equipment, with a focus on thermocompression and flip-chip bonders, inspection systems and Micro Saw products. Its main markets are advanced HBM and artificial intelligence packaging, with operations extending from South Korea to Taiwan, China, Singapore and the United States.
Hanmi competes directly with Hanwha Semitech in HBM thermocompression bonders. Asia IP reported that Hanmi had previously been SK Hynix's primary TC bonder supplier before Hanwha entered the market in 2025, indicating an established position facing new competition.
Hanmi Semiconductor at a glance
- Company: Hanmi Semiconductor
- ISIN: KR7042700005
- Headquarters: Incheon, South Korea
- Core products: TC bonders, FC bonders, HBM inspection systems and Micro Saw equipment
South Korean semiconductor shares trade against the broader backdrop of the KOSPI market.
