Cadence Design Systems stock: company details expanded TSMC collaboration
Published on 09/29/2026 at 22:26 | Editorial responsibility: Rafael Müller, Editor-in-Chief AD HOC NEWS
Cadence Design Systems detailed an expanded collaboration with TSMC covering certified tool flows, silicon-proven intellectual property and advanced design capabilities for artificial-intelligence and high-performance-computing customers. The announcement was dated September 23, 2026. Cadence Newsroom reported that Cadence achieved tool certification for TSMC’s A14 process, demonstrated a UALink solution in TSMC N3P and introduced silicon-proven IP for N3P and N2P.
Expanded process and packaging support
The company said its digital full-flow, signoff and custom/analog flows were certified for TSMC A16 and A14 technologies, while analog, digital and signoff flows were certified for N2P. Cadence also said its solutions support TSMC SoW-X designs with hundreds of chiplets and millions of bumps. Cadence Newsroom said the companies’ work includes AI chip and three-dimensional integrated-circuit design flows across TSMC’s N3, N2, A16 and A14 technologies.
Automotive DSP collaboration
In a separate announcement dated September 15, 2026, Cadence said its Tensilica IP Group and Analog Devices worked together on the next generation of SHARC automotive audio processors. Business Wire reported that the SHARC-FX processor core provides five times the performance of the previous-generation SHARC+ processor used in the ADSP-SC59x family. Business Wire said the new platform is intended for automotive audio, voice and artificial-intelligence workloads.
