Besi stock after-hours: Applied Materials partnership expands
Published on 10/06/2026 at 18:03 | Editorial responsibility: Rafael Müller, Editor-in-Chief AD HOC NEWS
Besi stock after-hours: Applied Materials partnership expands. On October 1, 2026, BE Semiconductor Industries N.V. and Applied Materials announced an expansion of their strategic partnership, with Besi joining Applied’s EPIC Center as an Innovation Partner. GlobeNewswire reported the announcement.
Expanded advanced-packaging collaboration
The companies said the expanded cooperation builds on a joint development program launched in 2020 and extends beyond die-to-wafer hybrid bonding. The stated focus includes next-generation 3D integrated-circuit scaling, logic and memory integration, and photonics applications supporting semiconductor AI infrastructure. The release said Besi engineers will work with Applied Materials teams at the EPIC Center.
Technology areas
The planned research and development programs include new die-to-wafer hybrid-bonding platforms, scaling of thermo-compression bonding, and die-on-wafer, die-on-die and die-on-panel integration platforms. The collaboration also covers photonics-enabled interconnect applications, including co-packaged optics. GlobeNewswire identified Besi’s ordinary shares as listed on Euronext Amsterdam under the symbol BESI.
