LPKF receives purchase LOI from leading Asian advanced semiconductor packaging manufacturer, confirming equipment selection for production ramp-up

LPKF Laser & Electronics SE / DE0006450000

EQS-Ad-hoc: LPKF Laser & Electronics SE / Key word(s): Significant contracts


23-Sep-2026 / 14:11 CET/CEST
Disclosure of an inside information acc. to Article 17 MAR of the Regulation (EU) No 596/2014, transmitted by EQS News - a service of EQS Group.
The issuer is solely responsible for the content of this announcement.

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  Ad hoc-Announcement - Inside information pursuant to Article 17 MAR Garbsen, 23 September 2026 – LPKF Laser & Electronics SE has received a Letter of Intent (LOI) from a leading Asian advanced semiconductor packaging manufacturer for the purchase of its NEXAR LIDE glass processing systems, confirming the selection of LPKF in the equipment stack. The customer plans to use the systems for the initial ramp-up of its glass substrate production facility for high-performance advanced packaging solutions. The letter confirms the intent to purchase equipment in the mid-single-digit million euro range, with the order expected shortly. The project supports LPKF’s growth strategy in glass-based advanced packaging for high-performance computing and AI applications.     


Contact:
Bettina Schäfer, Department Manager Group Communication & Investor Relations

End of Inside Information

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23-Sep-2026 CET/CEST The EQS Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases.
View original content: EQS News

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Language:	English
Company:	LPKF Laser & Electronics SE
	Osteriede 7
	30827 Garbsen
	Germany
Phone:	[phone]
Fax:	[phone]
E-mail:	[e-mail]
Internet:	www.lpkf.com
ISIN:	DE0006450000
WKN:	645000
Indices:	SDAX
Listed:	Regulated Unofficial Market in Hamburg, Stuttgart, Tradegate BSX
LEI Code:	529900BCQXUJL7J96G45
EQS News ID:	2404032

End of Announcement	EQS News Service

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2404032  23-Sep-2026 CET/CEST