ULVAC, Inc., Electronics

Chigasaki, Japan, Mar 21, 2017 - (JCN Newswire) - ULVAC, Inc.

21.03.2017 - 03:09:43

ULVAC Launches NA-1500 Dry Etching System for 600mm Advanced Packaging Substrate. is pleased to introduce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for uniform Descum and Ti etching processes.

Higher data transfer speeds require high-density packaging technologies, while advanced mobile and wireless devices require thinner and higher-pin-count IC packages. Fan-Out Wafer Level Packaging (FO-WLP) is widespread, while Panel Level Packaging increases substrate size from 300mm to 600mm.- Pretreatment for wet process such as plating, etc.

- Pretreatment for underfill

4. Resin material ashing

5. Seed layer Ti etching

6. SiO2/SiN etching

Images:

NA-1500 dry etching system -- http://bit.ly/2mTlx02

NA-1500 process chamber -- http://bit.ly/2nw2R4F

Notes:

1. Descum: Removal of residue (scum) in photolithography of photopolymer

2. CCP: Capacitive Coupling Plasma

3. Desmear: Removal of residue (smear) in Via formation with laser drill

Full Release with Process Performance (PDF) -- http://bit.ly/2nJgf4M

Our Future:

ULVAC has sold more than 200 dry etching systems since releasing our first 200mm wafer system 20 years ago. As electronic components become smaller and thinner, and higher-speed processing works on lower power in line with developments in IoT, manufacturing technologies for advanced packaging become more important. ULVAC supports this industry by providing systems that meet customer's future needs for flexible, invisible and wearable devices.

About ULVAC, Inc.

ULVAC, Inc., is a Japan-based vacuum equipment manufacturer. ULVAC was founded in 1952 and has contributed to development of industry and technology through comprehensive use of vacuum technology and its peripheral technology. We created "ULVAC SOLUTIONS" based on our one of a kind technologies built upon long years of research, development, and production technology innovations. We offer this solution composed of equipment, materials, analytic evaluation, vacuum components and other various services, for flat panel displays, solar cells, semiconductors, electronic components, and general industrial equipment. For more information, please visit www.ulvac.co.jp/en/.

Source: ULVAC, Inc.

Contact:
Masahiro Harada
Corporate Sales & Marketing Division I
Advance Electronics Equipment Sales Dept.
ULVAC, Inc.
TEL: +81-467-89-2139 / FAX: +81-467-89-2254
https://www.ulvac.co.jp/
https://www.ulvac.co.jp/en/
https://www.ulvac.co.jp/products_e/


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